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IC package substrate - List of Manufacturers, Suppliers, Companies and Products

IC package substrate Product List

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Flat pushback technology

A flat push-back board that achieves a flat finish for improved efficiency during assembly.

The "Flat Pushback Technology" provides a superior substrate during component mounting by suppressing the curvature of the sheet through advanced mold technology and our unique flat pushback sheet shape. It ensures the necessary holding force during component mounting while also being easy to separate after installation. Additionally, defective products within the sheet can be removed and replaced with good ones. 【Features】 ■ Flat shape that suppresses curvature ■ Advantageous during component mounting ■ Processing of half-cut through holes in the pushback area is also possible *For more details, please refer to the catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • Printed Circuit Board
  • Other electronic parts

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